Double-sided FPC with high density
& precision is achieved by our excellent circuit manufacturing
technology.
Material:
•Base layer : Polyimide 25µm+Cu 1/2oz ( Thickness
of PTH )
•Cover layer : Polyimide 25µm+adhesive 25µm+solder
resist 13µm
Trace pattern:
•Trace width & space : 50µm/50µm
•Diameter of PHT : ř100µm
•Diameter of land : ř300µm
Reliability test:
•Peel strength of the trace : > 0.7kg/cm
•Migration test : > 108O(85°C µ85%RH µ1,000h
50V DC )
•Heat shock test : 10 cycles(Dipping into oil 260°C*10s
←→ 25°C*10s)


Mobile phone, LCD, Digital AV, etc. |