For the electronic components needed in the latest electronic
devices, the adhesive technologies developed by Nitto Denko
over many years include a thermal release tape for precision
cutting processes, and porous sheet made of ultrahigh- molecular-weight
polyethylene, SUN MAP. In addition, Nitto Denko's paper carrier
tapes (for both axial and radial components) are used for
conveying electronic components and for automatic mounting.
For high-precision condensers, various cutting-edge adhesive
technologies, such as Nitto Denko's adhesive tape for condensers,
are employed.
Inside such products, and during the manufacturing process,
fluoroplastic NITOFLON Tapes No.900UL & No. 903UL, and
Nitto's surface protection material are used. Nitto Denko's
adhesive tape technology contributes to all of these. |