This product is used to protect sensitive optical devices
from heat and humidity. This product is available in liquid
type for casting and potting applications, and tablet type
for transfer molding applications.
This product is a molding compound used for package semiconductor
devices. Nitto Denko responds to the needs of semiconductor
products for higher speed, higher integration, and lower prices.
The preset underfill method of encapsulation is to set sheet
form underfill onto substrate and to be laminated with curing.
Semiconductor device with bumps is flip chip-bonded to substrate
with a piece of the epoxy resin sheet at same time, and it
leads to shorten through put time drastically.
This product is a non-vulcanized rubber-based cleaning material.
When this is pressed into the mold die, the rubber is vulcanized,
and contaminants combine with the rubber and are removed with
the sheet. |