 In
the semiconductor industry, which manufactures the devices
that support the electronics industry, Nitto Denko provides
equipment and materials that utilize cutting-edge technologies,
for all manufacturing stages from front-end process to back-end
process.
Our adhesive tapes are used to protect silicon wafers during
the back-grinding process, and the dicing process, in which
wafers are cut into chips containing microscopic circuit patterns.
In addition, Nitto Denko's various high-polymer separation
membranes are used to produce ultrapure water for washing
semiconductor wafers, and to filter solvents and inorganic
chemicals.
Nitto Denko's representative product for the semiconductor
industry, epoxy resin for semiconductor encapsulation, boasts
high levels of production in terms of both quality and quantity,
and commands top share of the global market.
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